Germany develops new high-temperature process to manufacture ultra-compact microchips

On May 20, according to People's Daily, researchers at the Fraunhofer Institute for Microelectronics Circuits and Systems (IMS) in Germany have made a breakthrough by developing a new high-temperature process that enables the production of ultra-compact microchips. These chips are not only smaller in size but can also operate efficiently at temperatures as high as 300°C. Traditional CMOS chips can handle up to 250°C, but their performance tends to degrade quickly under such conditions. Some alternatives involve cooling sensitive chips continuously, which is technically challenging and often impractical. Meanwhile, specialized high-temperature chips are available on the market, but they tend to be large—typically no smaller than 1 micron in size. The new microchip developed by IMS, however, measures just 0.35 microns, making it significantly smaller than existing high-temperature options while still maintaining full functionality. This advancement opens up new possibilities for applications where space and durability are critical. To achieve this, the research team employed a unique high-temperature silicon-on-insulator (SOI) CMOS process. This method uses an insulating layer to prevent leakage currents that could disrupt chip operations. Additionally, they replaced aluminum with tungsten, a material that is less affected by heat, thereby improving the long-term reliability of the chips. Beyond energy sectors like geothermal, natural gas, and oil production, these microchips hold great potential in aerospace. For example, they could be placed near turbine engines to monitor performance in real-time, helping improve efficiency and safety. This innovation marks a significant step forward in microchip technology, offering a reliable solution for extreme environments where traditional components fall short.

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