Electroplating process for anti-friction layer of sliding bearing

**Electroplating Process for the Anti-Friction Layer of Sliding Bearings** Home > Bearing Knowledge > Electroplating Process of Sliding Bearing Anti-Friction Layer *728*90 created on 2018/5/16* var cpro_id = "u3440131";

Electroplating Process for Anti-Friction Layer of Sliding Bearings

Source: China Bearing Network | Time: 2013-03-03

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The electroplating process of the anti-friction layer in sliding bearings is a critical step in ensuring long-term performance and reliability. When the anti-friction coating is directly applied to the fabric metal, tin tends to diffuse into the base material. Over time, this can lead to a reduction in tin content below 6% (by weight), while the copper-based alloy remains as an aluminum-based alloy. Both materials contain significant amounts of copper, which can react with the dispersed tin to form brittle intermetallic compounds such as Cu₃Sn. This not only degrades mechanical properties but also disrupts the structural integrity of the bearing. To address this issue, a common solution is to apply a thin layer of nickel or a nickel-based alloy between the fabric material and the anti-friction coating. This barrier layer prevents tin from diffusing into the base material, maintaining the stability of the composition and improving the overall durability of the bearing. Additionally, a protective layer made of tin or a lead-tin alloy can be used. This layer offers some corrosion resistance and helps maintain the balance of components within the anti-friction layer during operation. Since it contains no copper, it is relatively soft, allowing the bearing to meet the initial running-in requirements effectively. The development of this electroplating technique has a long history. In the 1920s, Groov (J. Grooff) filed the first patent for electroplating lead-tin alloys, which were later used in torpedo gas cylinders. By the early 1940s, the technology had been applied to bearing pads. In 1952, Schults proposed a patent for electroplating lead-tin-copper ternary alloys on aluminum and AlSi substrates. Schoefe later introduced the use of lead-tin-copper alloys for bushings. In 1976, Jong Sang Kim, Su Il Pyun, and Hyo Geun Lee published a paper titled *"Pore-Orientation and Microscopic Tracing of Lead-Tin-Copper Electroplating Layers."* In 1980, Beebe introduced a process for electroplating copper-containing ternary alloys with 2–3% copper and 9–12% tin, with a coating thickness of 15 μm. In 1982, Waterman et al. proposed a method to replace copper ions (Cu²⁺) in the ternary alloy plating bath, further refining the process.
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