What will happen after the emergence of chip-scale packaging (CSP) technology, will it end the traditional packaged rice bowl? Ruifeng Optoelectronics CTO Xiao Xiaoming also gave his own answer - "CSP will eat the traditional packaging worry about a little worry, but the emergence of CSP will certainly have an impact on the original package form, especially the old product line, especially large Power products, ceramic high power package".
More than 20 years of research and development of packaging technology, self-deprecating engineers from the underlying technology and overall solutions gradually become a feng shui in the packaging industry. Xiao Xiaoming believes that "CSP is definitely a new trend in the future, but its penetration rate and market share. It is not as big as imagined. Since CSP is a package without a bracket and a substrate, in addition, from the perspective of phosphor coating, the technical route taken by CSP may be the coating of liquid phosphor or fluorescent glue, or it may be Coating of solid-state fluorescent film. The investment in related equipment may change."
At the same time, Xiaoming Xiao pointed out that after the emergence of CSP, it seems that the chip jumped directly to the luminaire. Whether the package is short-circuited, whether the chip factory and the packaging factory have changed from the original partner to the mutual confrontation, how the chip factory and the package should cooperate. Yan Xiaoming stressed that “this market cannot be monopolized. CSP is not a unique advantage of chip factories. The packaging factory does not necessarily have a worse CSP than the chip factory. The packaging factory has broad customer resources, and the chip factory can provide CSP. For the packaging factory, the packaging factory is made into a module and then handed over to the downstream application customer."
It is particularly noteworthy that when LED lighting is gradually becoming standardized, the form of the module derived from the package and the application side will also become an industrial form.
The US Department of Energy's DOE report predicted that the cost of the entire LED package will be reduced by six times from 2012 to 2020. In this regard, Xiaoming Xiao believes that this goal is difficult to achieve if there is no revolutionary technological evolution simply by material or by improving efficiency.
LED packages range from in-line LEDs to high-power LEDs, PLCCLEDs, ceramic packages, EMC packages, and the most popular chip-scale package CSPs. The evolution of technology continues around the price/performance ratio (lm/$). Yan Xiaoming said that the advancement of LED technology is largely due to the advancement of related basic materials. From PPA materials, PCT materials to ceramic materials, as well as the most popular EMC and SMC materials technology in the past two years, the refractive index of materials has been continuously improved, and the heat resistance and UV resistance have been continuously improved, which has an impact on the performance of the entire product. quite big.
The technology that affects LED packaging, first of all, is the solid-welding technology, from the earliest silver-gel solid crystal, insulating glue to the eutectic; secondly, from the welding wire, from the earliest gold wire bonding wire to the flip chip without gold Wire bonding wire; from the coating technology of phosphors, from the earliest dispensing process, the graphic coating process, to the remote excitation process. In Xiao Mingming's view, the evolution of these technologies will have an impact on packaging manufacturing processes and equipment investment.
When the demographic dividend is no longer an advantage, the biggest shift in the packaging line may be machine replacement. In addition, product standardization, production efficiency, and capital scale will become the mainstream of the packaging industry.
Finally, Yan Xiaoming concluded that the traction of market demand and the promotion of technological progress are the two major drivers of industrial development. The evolution of technology has always focused on product cost performance, and cost is the first factor. The introduction of new technologies will have a certain impact on the traditional packaging industry. And LED packaging will eventually be a small profit industry that fights capital, fights scale, and fights management.
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