Aluminum heat sink fin
This is the most common form of heat dissipation, with aluminum fins as part of the enclosure to increase heat dissipation.
2. Thermal plastic shell
The plastic shell is filled with a heat conductive material during injection molding, which increases the heat conduction and heat dissipation capability of the plastic shell.
3. Surface radiation heat treatment
The surface of the lamp housing is radiated and heat-dissipated. The simple method is to apply radiation heat-dissipating paint, which can radiate heat away from the surface of the lamp housing.
4. Aerodynamics
The use of the shape of the lamp housing creates convective air, which is the lowest cost way to enhance heat dissipation.
5. Fan
The inside of the lamp housing uses a long-life and high-efficiency fan to enhance heat dissipation, and the cost is low and the effect is good. However, it is more troublesome to change the fan, and it is not suitable for outdoor use. This design is rare.
6. Heat pipe
Heat pipe technology is used to conduct heat from the LED chip to the heat sink fins of the case. Large lamps, such as street lamps, are common designs.
7. Liquid bulbs
The liquid bubble encapsulation technology is used to fill a transparent liquid with a high thermal conductivity into the bulb of the lamp body. This is the only technology that uses the light-emitting surface of the LED chip to transmit heat and dissipate heat in addition to the principle of reflection.
8. Utilization of the lamp holder
In household-type smaller-power LED lamps, the internal space of the lamp cap is often used to partially or completely put the heat-generating drive circuit. This makes it possible to dissipate heat from a lamp cap having a large metal surface such as a screw cap because the lamp cap is in close contact with the metal electrode of the lamp holder and the power cord. Therefore, a part of the heat can be derived from heat dissipation.
9. Integration of heat conduction and heat dissipation--Application of high thermal conductivity ceramics
The purpose of heat dissipation of the lamp housing is to reduce the operating temperature of the LED chip. Since the expansion coefficient of the LED chip is very different from the commonly used metal heat conduction and heat dissipation material expansion coefficient, the LED chip cannot be directly soldered to prevent high and low temperature thermal stress from damaging the LED chip. The latest high thermal conductivity ceramic material, the thermal conductivity is close to aluminum, and the expansion system can be adjusted to synchronize with the LED chip. In this way, heat conduction and heat dissipation can be integrated to reduce the intermediate part of heat conduction.
Affect the performance of led lamps is multi-faceted, only to fully consider all aspects to produce qualified products. As a LED manufacturing company, we can fully develop our innovative thinking and develop our own core technologies to truly stand on the market. At present, the production of led lamps is mainly in Shenzhen and Zhongshan, occupying most of the market share in the country. The development of the northern part is relatively lagging behind by the industrial chain. The enterprises mainly based on Qingdao Haige Energy Saving Technology and Weifang Zhongwei Optoelectronics are gradually developing. .
As a new generation of energy-saving light source, LED energy-saving lamps have broad application prospects, but there are still many technical problems in front of them, and we look forward to the improvement of the market.
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