Group4 was founded in 2003 and began to cooperate with Element Six in 2008. Group4 developed a synthetic semiconductor wafer and claimed to be the first commercial product. Such sheets include gallium nitride and diamond. Because of the transistor-based loops produced by some manufacturers, they have high power, high temperature and high frequency characteristics. For these reasons, the first diamond-based GaN system has been specially developed. This system has a fast and efficient heat dissipation function and is low in cost. This operation reduces the operating temperature of the packaging equipment and solves the heat dissipation problem of more than 50% of all electronic faults. Compared to existing heat sink materials: copper, silicon carbide, and synthetic diamonds are five times more heat-dissipating, and equipment manufacturers can produce smaller, faster, higher-power electronic components and the use of these components. Longer life and better reliability.
When applied to power amplifiers, microwave ovens and millimeter-wave circuits, diamond-based GaN systems can provide protection and provide a beneficial side for commercially available devices, including mobile stations, radar sensing devices, weather and Communication satellite equipment, frequency converters and converters for use in hybrid and electric vehicles.
In April, RF front-end component manufacturer and foundry service provider, Hillsboro TriQuint Semiconductor Co., Ltd. said: Under the joint efforts of Bristol University, Group4 and Lockheed Martin, the US Department of Defense The Advanced Project Research Institute (DARPA) Near-Hole Point Heat Transfer (NJTT) project has validated a new high-electron mobility transistor for diamond-based gallium nitride. TriQuint has used this technology to design new equipment. These devices have tripled their heat dissipation (the original goal of NJTT) while still retaining the RF functionality. It can be said that the size of the power amplifier may also be reduced by three times, or the output power is increased.
Adrian Wilson, head of R&D at Element Six, said: "Diamond-based GaN wafers are likely to occupy the center of our customer's technology roadmap at any time. As a new development, it has proven to have greatly reduced equipment temperature while still being able to Keeping the output performance of the device." He added: "The diamond-based GaN program developed by Group4 now purchases this intellectual property, and we plan to continue to support the market's growth trajectory and rising manufacturing capabilities. Deliver innovative synthetic diamond solutions to meet the growth needs of emerging markets."
Felix Ejeckam, Chairman and CEO of Group4, said: "The increase in the production of diamond-based GaN wafers requires unique manufacturing techniques and capabilities, which must be achieved in cooperation with Element Six. He also believes that customers will also Gaining great benefits from this technology acquisition. (Excerpt from "Element Six acquires Group4 Labs to expand portfolio of synthetic diamond materials", translated by Ma Yanping)
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